The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2020

Filed:

Jul. 26, 2017
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Yoichi Harayama, Nagano, JP;

Yoji Asahi, Nagano, JP;

Keiichi Takemoto, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/67 (2006.01); H02N 13/00 (2006.01); H01L 21/687 (2006.01); H05B 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); H01L 21/67103 (2013.01); H01L 21/6831 (2013.01); H02N 13/00 (2013.01); H01L 21/67109 (2013.01); H01L 21/68714 (2013.01); H05B 3/00 (2013.01);
Abstract

A substrate fixing device includes a baseplate, an electrostatic chuck, and an insulating layer interposed between the baseplate and the electrostatic chuck. The insulating layer includes a heating element formed of a first material and a wiring line connected in series to the heating element. The wiring line includes a first conductive layer formed of the first material and a second conductive layer joined onto the first conductive layer. The second conductive layer is formed of a second material having a resistivity lower than the resistivity of the first material.


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