The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2020

Filed:

Nov. 03, 2017
Applicant:

Varian Semiconductor Equipment Associates, Inc., Gloucester, MA (US);

Inventors:

Adam M. McLaughlin, Merrimac, MA (US);

Craig R. Chaney, Gloucester, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/00 (2006.01); H01J 37/317 (2006.01); G05B 13/02 (2006.01); H01L 21/425 (2006.01); H01J 37/075 (2006.01); H01L 21/265 (2006.01); H01J 27/20 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3172 (2013.01); G05B 13/021 (2013.01); H01J 27/205 (2013.01); H01J 37/075 (2013.01); H01L 21/265 (2013.01); H01L 21/425 (2013.01);
Abstract

A system that utilizes a component that controls thermal gradients and the flow of thermal energy by variation in density is disclosed. Methods of fabricating the component are also disclosed. The component is manufactured using additive manufacturing. In this way, the density of different regions of the component can be customized as desired. For example, a lattice pattern may be created in the interior of a region of the component to reduce the amount of material used. This reduces weight and also decreases the thermal conduction of that region. By using low density regions and high density regions, the flow of thermal energy can be controlled to accommodate the design constraints.


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