The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2020
Filed:
Oct. 21, 2015
Mitsubishi Materials Corporation, Tokyo, JP;
Koichi Kita, Kitamoto, JP;
Koji Hoshino, Kitamoto, JP;
Toshihiko Saiwai, Kitamoto, JP;
Jun Katoh, Kitamoto, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
A porous copper sintered material () includes: a plurality of copper fibers () sintered each other, wherein the copper fibers () are made of copper or copper alloy, a diameter R of the copper fibers () is in a range of 0.02 mm or more and 1.0 mm or less, and a ratio L/R of a length L of the copper fibers to the diameter R is in a range of 4 or more and 2500 or less (), redox layers () formed by redox treatment are provided on surfaces of copper fibers (), and concavities and convexities are formed by the redox layer (), and each of redox layers () formed on each of the copper fibers () is integrally bonded in a junction of the copper fibers ().