The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2020

Filed:

Jul. 03, 2019
Applicant:

At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventor:

Gernot Grober, Graz, AT;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/42 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 3/429 (2013.01); H05K 1/115 (2013.01); H05K 1/18 (2013.01); H05K 3/0038 (2013.01); H05K 3/422 (2013.01); H05K 3/428 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/09545 (2013.01);
Abstract

A method of manufacturing a component carrier is provided. The method includes forming a through hole between a first main surface and a second main surface of an electrically insulating layer structure by removing material from at least one of the main surfaces of the electrically insulating layer structure, in particular by irradiating at least one of the main surfaces of the electrically insulating layer structure with at least one laser shot, wherein the at least one main surface from which material is removed, in particular which is to be irradiated, is not covered by an electrically conductive layer structure at least in a surface region in which the through hole is to be formed, and subsequently at least partially filling the through hole and at least partially covering the main surfaces of the electrically insulating layer structure by an electrically conductive filling medium.


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