The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2020
Filed:
Mar. 06, 2018
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01Q 1/02 (2006.01); H01Q 1/24 (2006.01); H01Q 21/06 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 23/3672 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/66 (2013.01); H01Q 1/02 (2013.01); H01Q 1/243 (2013.01); H01Q 21/065 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01);
Abstract
A semiconductor package device includes a substrate, an antenna and a conductor. The substrate has an upper surface. The antenna is disposed on the upper surface of the substrate. The conductor is disposed on the upper surface of the substrate and surrounds the antenna. The conductor has a first surface facing toward the antenna and a second surface opposite to the first surface. The second surface of the conductor is spaced apart from the upper surface of the substrate.