The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2020
Filed:
Sep. 13, 2016
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Mitsuru Yamazaki, Oshu, JP;
Koji Yamashita, Tokyo, JP;
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 43/12 (2006.01); F27B 3/08 (2006.01); F27D 7/06 (2006.01); F27B 5/04 (2006.01); F27D 11/12 (2006.01); F27D 19/00 (2006.01); F27D 21/00 (2006.01);
U.S. Cl.
CPC ...
H01L 43/12 (2013.01); F27B 3/08 (2013.01); F27B 5/04 (2013.01); F27D 7/06 (2013.01); F27D 11/12 (2013.01); F27D 19/00 (2013.01); F27D 21/00 (2013.01);
Abstract
There is provided a semiconductor device manufacturing method which includes: loading a substrate with a magnetic substance film formed thereon into a process container; regulating an internal pressure of the process container to a first pressure lower than an atmospheric pressure; regulating the internal pressure of the process container from the first pressure to a second pressure higher than the first pressure; and magnetizing the magnetic substance film by applying a magnetic field to the magnetic substance film under the second pressure.