The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2020

Filed:

Dec. 06, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Sebastian U. Engelmann, White Plains, NY (US);

Eric A. Joseph, White Plains, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/308 (2006.01); H01L 21/66 (2006.01); H01L 21/311 (2006.01); H01L 21/02 (2006.01); H01L 21/3065 (2006.01); H01L 21/265 (2006.01);
U.S. Cl.
CPC ...
H01L 22/26 (2013.01); H01L 21/0228 (2013.01); H01L 21/265 (2013.01); H01L 21/30655 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01);
Abstract

A method of forming integrated circuit (IC) chips. After masking a layer of a material to be etched, the layer is subjected to an atomic layer etch (ALE). During the ALE, etch effluent is measured with a calorimetric probe. The calorimetric probe results reflect a species of particles resulting from etching the material. The measured etch results are checked until the results indicate the particle content is below a threshold value. When the content is below the threshold ALE is complete and IC chip fabrication continues normally.


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