The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2020

Filed:

Jan. 20, 2016
Applicant:

Mfc Sealing Technology Co., Ltd., New Taipei, TW;

Inventors:

Yo-Yu Chang, New Taipei, TW;

Chun-Yao Huang, New Taipei, TW;

Assignee:

MFC Sealing Technology Co., Ltd., New Taipei, unknown;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01J 37/32 (2006.01); F16J 15/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); F16J 15/106 (2013.01); H01J 37/3288 (2013.01); H01J 37/32513 (2013.01); H01J 37/32697 (2013.01); H01J 37/32715 (2013.01);
Abstract

Provided is a barrier seal for an electrostatic chuck in the plasma etching process. The barrier seal comprises multiple sealing portions to block the connecting layer of the electrostatic chuck and the plasma gas. The groove of the electrostatic chuck may be completely filled by the barrier seal. Even one of the multiple sealing portions is destroyed in the plasma etching process by the plasma gas, the barrier seal still prevents leaking of the electrostatic chuck effectively. The barrier seal provides a buffer period for engineers to replace the damaged barrier seal before the leaking occurs. Danger of leaking caused by abrupt breaking of the barrier seal is reduced. Furthermore, the barrier seal facilitates stability and safety of the plasma etching process. The yield of products manufactured by the electrostatic chuck may be improved.


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