The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2020

Filed:

Dec. 28, 2015
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Asad Mahmood Haider, Plano, TX (US);

Qhalid Fareed, Plano, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 29/20 (2006.01); H01L 29/43 (2006.01); H01L 29/778 (2006.01); H01L 21/8252 (2006.01); H01L 27/06 (2006.01); H01L 27/085 (2006.01); H01L 29/10 (2006.01); H01L 27/088 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01L 21/02381 (2013.01); H01L 21/02458 (2013.01); H01L 21/02502 (2013.01); H01L 21/8252 (2013.01); H01L 27/0605 (2013.01); H01L 27/085 (2013.01); H01L 29/2003 (2013.01); H01L 29/432 (2013.01); H01L 29/7786 (2013.01); H01L 27/0883 (2013.01); H01L 29/1066 (2013.01);
Abstract

A method of fabricating an epitaxial stack for Group IIIA-N transistors includes depositing at least one Group IIIA-N buffer layer on a substrate in a deposition chamber of a deposition system. At least one Group IIIA-N cap layer is then deposited on the first Group IIIA-N buffer layer. During a cool down from the deposition temperature for the cap layer deposition the gas mixture supplied to the deposition chamber includes NH3 and at least one other gas, wherein the gas mixture provide an ambient in the deposition chamber that is non-etching with respect to the cap layer so that at a surface of the cap layer there is (i) a root mean square (rms) roughness of <10 Å and (ii) a pit density for pits greater than (>) 2 nm deep less than (<) 10 pits per square μm with an average pit diameter less than (<) 0.05 μm.


Find Patent Forward Citations

Loading…