The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2020

Filed:

Jun. 17, 2016
Applicant:

Nan Ya Plastics Corporation, Taipei, TW;

Inventors:

Cheng-Chung Lee, Taipei, TW;

Yeong-Tong Hwang, Taipei, TW;

Shih-Hung Hsu, Taipei, TW;

Shao-En Hwang, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/031 (2006.01); G03F 7/038 (2006.01); G03F 7/027 (2006.01); H05K 3/34 (2006.01); G03F 7/004 (2006.01);
U.S. Cl.
CPC ...
G03F 7/031 (2013.01); G03F 7/027 (2013.01); G03F 7/038 (2013.01); G03F 7/0385 (2013.01); G03F 7/0388 (2013.01); H05K 3/3452 (2013.01); G03F 7/0047 (2013.01);
Abstract

A low dielectric constant (Dk) and dissipation factor (Df) of solder resistant mask composition comprising (A) a photopolymerizable prepolymer of formula (1); (B) a photopolymerizable vinyl monomer; (C) an epoxy compound; (D) a photopolymerization initiator; (E) an inorganic filler; (F) a catalyst; and (G) an organic solvent. The low dielectric constant (Dk) and dissipation factor (Df) of solder resistant mask composition has excellent photo and thermocurability, and high developability resolution with an alkaline aqueous solution, wherein the dielectric constant is below 3.20 (1 GHz), and the dissipation factor is less than 0.015 (1 GHz);


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