The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2019
Filed:
Jan. 31, 2019
Applicant:
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;
Inventor:
Michiro Ogawa, Nagano, JP;
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01);
Abstract
An electronic component-embedded substrate includes a first insulation layer having a quadrangular cavity formed therein, and an electronic component arranged in the cavity. The cavity has two adjacent first inner wall surfaces, protrusions protruding inward from the two first inner wall surfaces, respectively, and two adjacent inclined second inner wall surfaces arranged at opposite sides to the two first inner wall surfaces and inclined downward from an outer side toward an inner side. The electronic component is in contact with the protrusions of the cavity.