The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2019

Filed:

Nov. 21, 2018
Applicant:

Cooler Master Co., Ltd., New Taipei, TW;

Inventors:

Hsin-Hung Chen, New Taipei, TW;

Chien-Liang Lin, New Taipei, TW;

Assignee:

COOLER MASTER CO., LTD., New Taipei, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H05K 7/20254 (2013.01); H05K 7/20272 (2013.01); H05K 2201/064 (2013.01); H05K 2201/10409 (2013.01);
Abstract

A liquid cooling device, which is configured to be in thermal contact with a first and a second heat sources which are disposed on a PCB, includes a first and a second thermal plates and a first and a second thermal blocks. The first thermal plate is configured to be disposed on the PCB. The second thermal plate is disposed on the first thermal plate. The thermal plates together form a storage space configured to store a coolant. The thermal blocks are configured to respectively be in thermal contact with the heat sources. The thermal blocks are movably disposed on the second thermal plate, such that protruding heights of the thermal blocks from the second thermal plate are adjustable respectively according to a gap width between the first heat source and the second thermal plate and a gap width between the second heat source and the second thermal plate.


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