The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2019
Filed:
Jul. 06, 2018
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Changhan Yun, San Diego, CA (US);
Chengjie Zuo, San Diego, CA (US);
Mario Velez, San Diego, CA (US);
Niranjan Sunil Mudakatte, San Diego, CA (US);
Shiqun Gu, San Diego, CA (US);
Jonghae Kim, San Diego, CA (US);
David Berdy, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/16 (2006.01); H01L 21/48 (2006.01); H01L 23/522 (2006.01); H01L 23/64 (2006.01); H01L 23/00 (2006.01); H04B 1/00 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 27/01 (2006.01); H01L 49/02 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H04B 1/1638 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/5223 (2013.01); H01L 23/64 (2013.01); H01L 23/66 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 27/01 (2013.01); H01L 28/10 (2013.01); H01L 28/40 (2013.01); H04B 1/006 (2013.01); H05K 1/165 (2013.01); H05K 1/185 (2013.01); H05K 3/4605 (2013.01); H01F 17/0013 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6672 (2013.01); H01L 2223/6677 (2013.01); H01L 2223/6688 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/24195 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19105 (2013.01); H05K 2201/097 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/09536 (2013.01); H05K 2201/09827 (2013.01);
Abstract
In an illustrative example, an apparatus includes a passive-on-glass (POG) device integrated within a glass substrate. The apparatus further includes a semiconductor die integrated within the glass substrate.