The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2019
Filed:
Oct. 05, 2018
Hitachi Power Semiconductor Device, Ltd., Hitachi-shi, Ibaraki, JP;
Masakazu Sagawa, Tokyo, JP;
Takahiro Morikawa, Tokyo, JP;
Motoyuki Miyata, Tokyo, JP;
Kan Yasui, Ibaraki, JP;
Toshiaki Morita, Ibaraki, JP;
HITACHI POWER SEMICONDUCTOR DEVICE, LTD., Ibaraki, JP;
Abstract
A semiconductor chip includes a semiconductor substrate made of SiC, a front surface electrode formed in a principal surface of the semiconductor substrate, and a rear surface electrode (drain electrode) formed in a rear surface of the semiconductor substrate. The front surface electrode is bonded to a wire, and includes an Al alloy film containing a high melting-point metal. The Al alloy film contains a columnar Al crystal which extends along a thickness direction of the Al alloy film, and an intermetallic compound is precipitated therein.