The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2019

Filed:

Jul. 02, 2018
Applicants:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Toshiba Electronic Devices & Storage Corporation, Minato-ku, JP;

Inventor:

Toshifumi Nishiguchi, Hakusan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/02 (2006.01); H01L 29/06 (2006.01); H01L 21/3205 (2006.01); H01L 29/10 (2006.01); H01L 29/417 (2006.01); H01L 29/78 (2006.01); H01L 29/739 (2006.01); H01L 21/768 (2006.01); H01L 21/3065 (2006.01); H01L 21/02 (2006.01); H01L 21/225 (2006.01); H01L 21/324 (2006.01); H01L 21/265 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0661 (2013.01); H01L 21/02129 (2013.01); H01L 21/2255 (2013.01); H01L 21/26513 (2013.01); H01L 21/3065 (2013.01); H01L 21/324 (2013.01); H01L 21/7684 (2013.01); H01L 21/76852 (2013.01); H01L 21/76895 (2013.01); H01L 29/0696 (2013.01); H01L 29/1095 (2013.01); H01L 29/41741 (2013.01); H01L 29/7397 (2013.01); H01L 29/7813 (2013.01);
Abstract

According to one embodiment, a semiconductor device includes a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type, a third semiconductor region of the first conductivity type, a gate electrode, and a conductive portion. The second semiconductor region is provided on the first semiconductor region. The third semiconductor region is provided on the second semiconductor region. The gate electrode opposes, in a second direction with a gate insulating layer interposed, the third semiconductor region, the second semiconductor region, and the first semiconductor region. The second direction is perpendicular to a first direction from the second semiconductor region toward the third semiconductor region. The conductive portion includes first and second portions. The first and second portions are respectively arranged with the second and third semiconductor regions. A length of the first portion is longer than a length of the second portion.


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