The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2019
Filed:
Mar. 21, 2018
Applicant:
United Microelectronics Corp., Hsin-Chu, TW;
Inventors:
Chun Chiang, Hsinchu, TW;
Ying-Wei Tseng, Nantou County, TW;
Ping-Chen Chang, Pingtung County, TW;
Tien-Hao Tang, Hsinchu, TW;
Assignee:
UNITED MICROELECTRONICS CORP., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 27/02 (2006.01); H01L 23/60 (2006.01); G01R 31/00 (2006.01); G01R 31/28 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0248 (2013.01); G01R 31/002 (2013.01); G01R 31/2832 (2013.01); H01L 23/10 (2013.01); H01L 23/60 (2013.01);
Abstract
An electrostatic discharge (ESD) shielding semiconductor device and an ESD testing method thereof, the ESD shielding semiconductor device includes an integrated circuit, a seal ring and a conductive layer. The integrated circuit is disposed on a die, and the integrated circuit has a first region and a second region. The seal ring is disposed on the die to surround the integrated circuit. The conductive layer at least covers the first region, and which is electrically connected to the seal ring.