The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2019
Filed:
May. 01, 2018
Applicant:
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano-ken, JP;
Inventor:
Keigo Sato, Nagano, JP;
Assignee:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01L 23/498 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/642 (2013.01); H01L 23/49811 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 28/40 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A wiring substrate includes a substrate body, a post formed on an upper surface of the substrate body, a thin film capacitor, and a first insulation layer covering the thin film capacitor and the post. The thin film capacitor includes a reference hole extending through the thin film capacitor in a thickness-wise direction. The post is inserted through the reference hole.