The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2019

Filed:

Jul. 06, 2011
Applicants:

Tsun-jen Chan, Pingzhen, TW;

Yh-hsiu Hsiao, Zhunan Township, Miaoli County, TW;

LU Cheng-ta, Guishan Township, Taoyuan County, TW;

Jian-hong Wu, Tainan, TW;

Inventors:

Tsun-Jen Chan, Pingzhen, TW;

Yh-Hsiu Hsiao, Zhunan Township, Miaoli County, TW;

Lu Cheng-Ta, Guishan Township, Taoyuan County, TW;

Jian-Hong Wu, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); G05B 19/418 (2006.01);
U.S. Cl.
CPC ...
H01L 22/20 (2013.01); G05B 19/41865 (2013.01); G05B 2219/32298 (2013.01); G05B 2219/45031 (2013.01); H01L 22/12 (2013.01); H01L 2924/0002 (2013.01); Y02P 90/20 (2015.11);
Abstract

A method for processing a plurality of semiconductor wafers includes acquiring a process parameter measurement for each of the semiconductor wafers, associating each of the semiconductor wafers with one of a plurality of groups based on a respective process parameter measurement for each of the semiconductor wafers, where each respective group corresponds to a respective recipe, and for each one of the groups, processing ones of the semiconductor wafers associated with that group together according to a respective recipe.


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