The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2019
Filed:
Oct. 27, 2015
Applicant:
Analog Devices, Inc., Norwood, MA (US);
Inventors:
James Fiorenza, Carlisle, MA (US);
F. Jacob Steigerwald, North Andover, MA (US);
Edward F. Gleason, Cambridge, MA (US);
Susan L. Feindt, Andover, MA (US);
Assignee:
Analog Devices, Inc., Norwood, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); H01L 21/762 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 21/67 (2006.01); H01L 23/525 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7624 (2013.01); G03F 7/00 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 21/67144 (2013.01); H01L 23/525 (2013.01); H01L 2224/18 (2013.01); H01L 2224/24 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/82 (2013.01); H01L 2224/92244 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06593 (2013.01);
Abstract
A transfer printing method provides a first wafer having a receiving surface, and removes a second die from a second wafer using a die moving member. Next, the method positions the second die on the receiving surface of the first wafer. Specifically, to position the second die on the receiving surface, the first wafer has alignment structure for at least in part controlling movement of the die moving member.