The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2019
Filed:
Jun. 01, 2015
Applicant:
Toyo Tanso Co., Ltd., Osaka, Osaka, JP;
Inventors:
Assignee:
TOYO TANSO CO., LTD., Osaka-shi, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23Q 3/00 (2006.01); H01L 21/687 (2006.01); C23C 16/04 (2006.01); C23C 16/458 (2006.01); C23C 16/56 (2006.01); H01L 21/205 (2006.01); C23C 8/20 (2006.01); C23C 16/06 (2006.01); C23C 16/32 (2006.01); C30B 25/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68757 (2013.01); C23C 8/20 (2013.01); C23C 16/04 (2013.01); C23C 16/042 (2013.01); C23C 16/045 (2013.01); C23C 16/06 (2013.01); C23C 16/325 (2013.01); C23C 16/458 (2013.01); C23C 16/4581 (2013.01); C23C 16/56 (2013.01); C30B 25/12 (2013.01); H01L 21/205 (2013.01);
Abstract
Provided are a susceptor that, in forming a thin film on a wafer, can reduce impurities or the like adhering to the wafer and a method for manufacturing the same. A susceptor includes a base material () with a recess (), a tantalum carbide layer () formed directly on a bottom surface () and a side surface () of the recess (), and a silicon carbide layer () formed on a surface of the base material () except for the recess ().