The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2019

Filed:

Jul. 09, 2018
Applicant:

Koito Manufacturing Co., Ltd., Tokyo, JP;

Inventors:

Hiroki Fujimura, Shizuoka, JP;

Takashi Terayama, Shizuoka, JP;

Hiroki Ishibashi, Shizuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); B60R 16/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); B60R 16/02 (2013.01); H05K 1/0271 (2013.01); H05K 1/111 (2013.01); H05K 2201/09418 (2013.01);
Abstract

An on-vehicle electronic circuit mounting board includes: a surface mount type package component including a plurality of electrode pads disposed along an outer periphery of a component bottom surface; and a printed wiring board having a plurality of lands disposed along the plurality of electrode pads on a top surface of the printed wiring board opposed to the component bottom surface, and in which each land is disposed to be opposed to the corresponding electrode pad and electrically connected to the electrode pad by soldered connection. An outer soldering slope and an inner soldering slope are formed between a land of the plurality of lands and an electrode pad corresponding to the land, and the land is shifted with respect to the corresponding electrode pad such that one of the outer soldering slope and the inner soldering slope faces the wiring board side and the other faces the component side.


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