The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2019
Filed:
Sep. 02, 2016
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Jon Gregory Aday, Escondido, CA (US);
Hong Bok We, San Diego, CA (US);
Steve Joseph Bezuk, Poway, CA (US);
Nicholas Ian Buchan, San Jose, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/20 (2006.01); H01L 41/113 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/78 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 41/053 (2006.01);
U.S. Cl.
CPC ...
H01L 41/1132 (2013.01); H01L 21/561 (2013.01); H01L 21/76877 (2013.01); H01L 21/78 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 24/03 (2013.01); H01L 24/09 (2013.01); H01L 24/11 (2013.01); H01L 24/14 (2013.01); H01L 24/17 (2013.01); H01L 41/053 (2013.01); H01L 2224/0401 (2013.01);
Abstract
A package may include a substrate and a semiconductor die with the substrate having a smaller width than the semiconductor die and encapsulated in a mold compound. In one example, the package may be a wafer level package that allows an external connection on the backside of the package to enable manufacturing in a panel or wafer form.