The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2019

Filed:

May. 11, 2017
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventor:

Haruo Sorimachi, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/04 (2006.01); H01L 41/047 (2006.01); B06B 1/06 (2006.01); H01L 41/08 (2006.01);
U.S. Cl.
CPC ...
H01L 41/0475 (2013.01); B06B 1/0607 (2013.01); H01L 41/0825 (2013.01);
Abstract

A backing member includes: a resin layer which contains a filler; and a plurality of leads each of which is embedded in the resin layer to penetrate through the resin layer from an upper surface of the resin layer to a lower surface of the resin layer. Each of the leads includes a wiring portion, and a terminal portion connected to one end of the wiring portion. A width dimension and a depth dimension of the wiring portion are smaller than a width dimension and a depth dimension of the terminal portion, and an interval between adjacent ones of the wiring portions of the leads is wider than an average particle size of the filler.


Find Patent Forward Citations

Sorimachi, Haruo. (2019). Backing member (U.S. Patent No. 10516090). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10516090

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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