The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2019
Filed:
Nov. 07, 2014
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Martin Mischitz, Wernberg, AT;
Kurt Matoy, Villach, AT;
Assignee:
INFINEON TECHNOLOGIES AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/482 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 23/4824 (2013.01); H01L 24/03 (2013.01); H01L 24/36 (2013.01); H01L 24/84 (2013.01); H01L 24/37 (2013.01); H01L 2224/03848 (2013.01); H01L 2224/0501 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05111 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/371 (2013.01); H01L 2224/37599 (2013.01); H01L 2224/8485 (2013.01); H01L 2224/84801 (2013.01); H01L 2924/351 (2013.01);
Abstract
According to various embodiments, a semiconductor device may include: a contact pad; a metal clip disposed over the contact pad; and a porous metal layer disposed between the metal clip and the contact pad, the porous metal layer connecting the metal clip and the contact pad with each other.