The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2019

Filed:

Nov. 19, 2017
Applicant:

Renesas Electronics Corporation, Koutou-ku, Tokyo, JP;

Inventors:

Yoshiaki Sato, Tokyo, JP;

Shuuichi Kariyazaki, Tokyo, JP;

Kazuyuki Nakagawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 25/065 (2006.01); H05K 1/02 (2006.01); H01L 23/50 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 22/32 (2013.01); H01L 23/3157 (2013.01); H01L 23/3675 (2013.01); H01L 23/49822 (2013.01); H01L 23/49894 (2013.01); H01L 23/50 (2013.01); H01L 23/642 (2013.01); H01L 25/0655 (2013.01); H05K 1/0268 (2013.01); H01L 23/367 (2013.01); H01L 23/49827 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/73 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19103 (2013.01); H05K 1/0231 (2013.01); H05K 1/185 (2013.01); H05K 3/4602 (2013.01); H05K 2201/10015 (2013.01);
Abstract

A semiconductor device which provides improved reliability. The semiconductor device includes: a wiring substrate having a first surface and a second surface opposite to the first surface; a chip condenser built in the wiring substrate, having a first electrode and a second electrode; a first terminal and a second terminal disposed on the first surface; and a third terminal disposed on the second surface. The semiconductor device further includes: a first conduction path for coupling the first terminal and the third terminal; a second conduction path for coupling the first terminal and the first electrode; a third conduction path for coupling the third terminal and the first electrode; and a fourth conduction path for coupling the second terminal and the first electrode.


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