The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2019

Filed:

Jul. 09, 2018
Applicant:

Unimicron Technology Corp., Taoyuan, TW;

Inventors:

Chin-Sheng Wang, Taoyuan, TW;

Pei-Chang Huang, Taoyuan, TW;

Ra-Min Tain, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/467 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/467 (2013.01); H01L 23/3672 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01);
Abstract

A package carrier includes a multilayer circuit structure, at least one gas-permeable structure, a first outer circuit layer, a second outer circuit layer, a first solder mask and a second solder mask. The multilayer circuit structure has an upper surface and a lower surface opposite to each other and a plurality of through holes. The gas-permeable structure is in the form of a mesh and disposed in at least one of the through holes. The first and the second outer circuit layers respectively at least cover the upper and the lower surfaces. At least one first opening of the first solder mask exposes a portion of the first outer circuit layer and is disposed corresponding to the gas-permeable structure. At least one second opening of the second solder mask exposes a portion of the second outer circuit layer and is disposed corresponding to the gas-permeable structure.


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