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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10515830 B1

PDFFull Text
Date of Patent:
Dec. 24, 2019

Filed:

Nov. 02, 2016

First protective film-forming sheet, method for forming first protective film, and method for manufacturing semiconductor chip

Applicant:

Lintec Corporation, Tokyo, JP;

Inventors:

Masanori Yamagishi, Phoenix, AZ (US);

Akinori Sato, Saitama, JP;

Assignee:

LINTEC CORPORATION, Tokyo, JP;

Attorney:

Nixon & Vanderhye P.C.

Primary Examiner:

Sonya D McCall-Shepard

Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01); C09J 7/40 (2018.01); B32B 37/00 (2006.01); C09J 5/06 (2006.01); H01L 21/78 (2006.01); C09J 7/29 (2018.01); C09J 7/20 (2018.01); H01L 21/304 (2006.01); B32B 27/00 (2006.01); C09J 5/00 (2006.01); C09J 201/00 (2006.01); C09J 7/38 (2018.01);
U.S. Cl.
CPC ...
H01L 21/568 (2013.01); B32B 27/00 (2013.01); B32B 37/025 (2013.01); C09J 5/00 (2013.01); C09J 5/06 (2013.01); C09J 7/20 (2018.01); C09J 7/29 (2018.01); C09J 7/38 (2018.01); C09J 7/401 (2018.01); C09J 201/00 (2013.01); H01L 21/304 (2013.01); H01L 21/563 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 23/3157 (2013.01); B32B 2457/14 (2013.01); C09J 2423/006 (2013.01); C09J 2463/005 (2013.01); C09J 2467/006 (2013.01); C09J 2475/00 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68377 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/94 (2013.01);
Abstract

The present invention relates to a first protective film-forming sheet formed by stacking a first pressure-sensitive adhesive layer on a first base material and stacking a curable resin layer on the first pressure-sensitive adhesive layer, in which the curable resin layer is a layer to form a first protective film on a bump-provided surface of a semiconductor wafer by being attached to the surface and cured, a sum of a thickness of the curable resin layer and a thickness of a first pressure-sensitive adhesive layer is 110 μm or more, and the thickness of the curable resin layer is 20 μm to 100 μm.

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