The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2019
Filed:
Jan. 15, 2018
Samsung Electronics Co., Ltd., Suwon-si, KR;
Korea Advanced Institute of Science and Technology, Daejeon, KR;
Min-woo Rhee, Seoul, KR;
Duke Kimm, Suwon-si, KR;
Jae-hong Kim, Seoul, KR;
Ji-nyeong Yun, Yongin-si, KR;
In-kyu Park, Daejeon, KR;
Jun-bo Yoon, Daejeon, KR;
Dong-uk Kwon, Daejeon, KR;
Seung-hwan Kim, Daejeon, KR;
Chang-keun Kim, Daejeon, KR;
Yong-hoon Yoon, Daejeon, KR;
SAMSUNG ELECTRONICS CO., LTD., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY, Daehak-Ro, Yuseong-Gu, Daejeon, KR;
Abstract
Provided are improved manufacturing methods of semiconductor devices, probe cards, test apparatuses including the probe card, and methods for manufacturing probe cards. The probe card includes a circuit board, a support located under the circuit board, and a plurality of probe needles located on a bottom surface of the support. Each of the probe needles has a tip configured to contact a side surface of a bump included in a test target. The support may include a stress absorption layer located on a bottom surface to which the probe needles are connected. Manufacturing of semiconductor devices may comprise forming elongated conductive bumps on a body of a semiconductor device, testing the semiconductor device by contacting tips of the probe needles to sides surfaces of the bumps and packaging of the semiconductor device.