The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2019

Filed:

Nov. 28, 2016
Applicant:

Atotech Deutschland Gmbh, Berlin, DE;

Inventors:

Andreas Walter, Berlin, DE;

Christof Suchentrunk, Berlin, DE;

Thomas Beck, Berlin, DE;

Gerhard Steinberger, Berlin, DE;

Holger Bera, Berlin, DE;

Heiko Brunner, Berlin, DE;

Bernd Froese, Berlin, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/44 (2006.01); C23C 18/16 (2006.01); H05K 3/18 (2006.01); H01L 21/288 (2006.01); H05K 3/24 (2006.01); C23C 18/32 (2006.01);
U.S. Cl.
CPC ...
C23C 18/44 (2013.01); C23C 18/1683 (2013.01); H01L 21/288 (2013.01); H05K 3/187 (2013.01); H05K 3/244 (2013.01); C23C 18/1651 (2013.01); C23C 18/32 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0736 (2013.01);
Abstract

The invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the invention comprises a source for palladium ions, a reducing agent for palladium ions and an unsaturated compound. The aqueous plating bath composition according to the invention has an improved stability against undesired decomposition due to the unsaturated compounds while keeping the deposition rate for palladium at the desired satisfying value. The aqueous plating bath composition has also a prolonged life time. The unsaturated compounds of the invention allow for adjusting the deposition rate to a satisfying range over the bath life time and for electrolessly depositing palladium layers at lower temperatures.


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