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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10513605 B1

PDFFull Text
Date of Patent:
Dec. 24, 2019

Filed:

Sep. 14, 2016

Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same

Applicant:

Shengyi Technology Co., Ltd., Guangdong, CN;

Inventors:

Hui Li, Guangdong, CN;

Kehong Fang, Guangdong, CN;

Yongjing Xu, Guangdong, CN;

Assignee:

SHENGYI TECHNOLOGY CO., LTD., , CN;

Attorney:

McDonald Hopkins LLC

Primary Examiner:

Kregg T Brooks

Int. Cl.
CPC ...
C08L 63/10 (2006.01); C08L 35/06 (2006.01); H05K 1/03 (2006.01); C08G 59/42 (2006.01); B32B 15/092 (2006.01); C08G 59/40 (2006.01); C07D 233/00 (2006.01); C07D 265/36 (2006.01); C08F 214/28 (2006.01); C08J 5/24 (2006.01); H05K 1/05 (2006.01); B32B 27/38 (2006.01); B32B 27/18 (2006.01); B32B 27/26 (2006.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); C08L 63/00 (2006.01); C08K 3/36 (2006.01); B32B 17/04 (2006.01); C08K 5/5399 (2006.01); C08K 5/51 (2006.01); B32B 15/20 (2006.01);
U.S. Cl.
CPC ...
C08L 63/10 (2013.01); B32B 15/092 (2013.01); B32B 15/20 (2013.01); B32B 17/04 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); B32B 27/26 (2013.01); B32B 27/302 (2013.01); B32B 27/38 (2013.01); C08G 59/40 (2013.01); C08G 59/4014 (2013.01); C08G 59/42 (2013.01); C08G 59/4223 (2013.01); C08J 5/24 (2013.01); C08K 3/36 (2013.01); C08K 5/51 (2013.01); C08K 5/5399 (2013.01); C08L 35/06 (2013.01); C08L 63/00 (2013.01); H05K 1/03 (2013.01); H05K 1/0313 (2013.01); H05K 1/0353 (2013.01); H05K 1/05 (2013.01); C07D 233/00 (2013.01); C07D 265/36 (2013.01); C08F 214/28 (2013.01); C08J 2363/00 (2013.01); C08J 2435/06 (2013.01);
Abstract

The present invention relates to a halogen-free epoxy resin composition, a prepreg and a laminate containing the same. The halogen-free epoxy resin composition comprises 60 parts by weight of epoxy resin, from 15 to 28 parts by weight of benzoxazine resin, and from 10 to 20 parts by weight of styrene-maleic anhydride. The present invention discloses using from 15 to 28 parts by weight of benzoxazine resin and from 10 to 20 parts by weight of styrene-maleic anhydride to cure 60 parts by weight of epoxy resin, to ensure the Df stability of prepregs at different curing temperature conditions while maintaining low dielectric constant and low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

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