The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Jun. 30, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Jose Rodrigo Camacho Perez, Guadalajara Jalisco, MX;

Seong-Youp J. Suh, Portland, OR (US);

Tae-Young Yang, Hillsboro, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/24 (2006.01); H01Q 1/22 (2006.01); H01Q 1/48 (2006.01); H01Q 1/50 (2006.01); H01Q 13/02 (2006.01); H01Q 21/28 (2006.01); H01Q 5/40 (2015.01);
U.S. Cl.
CPC ...
H01Q 1/243 (2013.01); H01Q 1/2275 (2013.01); H01Q 1/48 (2013.01); H01Q 1/50 (2013.01); H01Q 5/40 (2015.01); H01Q 13/02 (2013.01); H01Q 21/28 (2013.01);
Abstract

An antenna including a substrate; top and bottom grounded conductive layers formed on respective larger faces of the substrate; an antenna feed coupled to at least one of the top and bottom grounded conductive layers, and configured to feed radio signals to the antenna; and at least one conductive wall formed to the top and bottom grounded conductive layers, and configured to form a short-circuit between the top and bottom grounded conductive layers, wherein the substrate and the at least one conductive wall forms a plurality of antenna cavities configured to operate at specific, respective frequencies, and each of the plurality of antenna cavities comprises at least two sides not covered by a conductive layer.


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