The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Jun. 12, 2019
Applicant:

Nthdegree Technologies Worldwide Inc., Tempe, AZ (US);

Inventors:

William Johnstone Ray, Phoenix, AZ (US);

Richard A. Blanchard, Los Altos, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/42 (2010.01); G02B 27/09 (2006.01); G02B 5/02 (2006.01); H01L 33/50 (2010.01); H01L 23/00 (2006.01); H01L 33/38 (2010.01); H01L 25/075 (2006.01); H01L 33/54 (2010.01); H01L 33/40 (2010.01);
U.S. Cl.
CPC ...
H01L 33/42 (2013.01); G02B 5/0205 (2013.01); G02B 27/0955 (2013.01); H01L 24/26 (2013.01); H01L 25/0753 (2013.01); H01L 33/387 (2013.01); H01L 33/502 (2013.01); H01L 33/405 (2013.01); H01L 33/54 (2013.01); H01L 2933/0066 (2013.01);
Abstract

Printed micro-LEDs have a top metal anode electrode that is relatively tall and narrow and a bottom cathode electrode. After the LED ink is cured, the bottom electrodes are in electrical contact with a conductive layer on a substrate. The locations of the LEDs are random. A thin dielectric layer is then printed between the LEDs, and a thin conductive layer, such as a nano-wire layer, is then printed over the dielectric layer to contact the anode electrodes. The top conductive layer over the tall anode electrodes has bumps corresponding with the locations of the LEDs. An omniphobic liquid is then printed which only resides in the 'low' areas of the top conductive layer between the bumps. Any optical material is then uniformly printed over the resulting surface. The printed optical material accumulates only on the bump areas by adhesion and surface tension, so is self-aligned with the individual LEDs.


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