The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Oct. 04, 2017
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Yen-Ting Ho, Taipei, TW;

Sung-Bin Lin, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 27/105 (2006.01); H01L 21/28 (2006.01); H01L 29/66 (2006.01); H01L 27/11517 (2017.01); H01L 29/51 (2006.01); H01L 29/423 (2006.01); H01L 29/788 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1052 (2013.01); H01L 21/28247 (2013.01); H01L 27/11517 (2013.01); H01L 29/40114 (2019.08); H01L 29/42324 (2013.01); H01L 29/518 (2013.01); H01L 29/6656 (2013.01); H01L 29/66477 (2013.01); H01L 29/66825 (2013.01); H01L 29/788 (2013.01);
Abstract

A manufacturing method of a semiconductor memory device includes the following steps. A gate structure is formed on a semiconductor substrate. The gate structure includes a floating gate electrode, a control gate electrode, a first oxide layer, and a second oxide layer. The control gate electrode is disposed on the floating gate electrode. The first oxide layer is disposed between the floating gate electrode and the semiconductor substrate. The second oxide layer is disposed between the floating gate electrode and the control gate electrode. An oxide spacer layer is conformally on the gate structure and the semiconductor substrate. A nitride spacer is formed on the oxide spacer layer and on a sidewall of the gate structure. An oxidation process is performed after the step of forming the nitride spacer. A thickness of an edge portion of the first oxide layer is increased by the oxidation process.


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