The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

May. 11, 2018
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Marianna Nomann, Ruethen, DE;

Elmar Kuehle, Warstein, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/14 (2006.01); H01L 23/49 (2006.01); H01L 23/15 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4875 (2013.01); H01L 21/481 (2013.01); H01L 23/142 (2013.01); H01L 23/49 (2013.01); H01L 23/49811 (2013.01); H01L 23/15 (2013.01); H01L 23/49833 (2013.01); H01L 24/48 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13055 (2013.01);
Abstract

A power semiconductor module arrangement includes a base plate configured to be arranged in a housing, a contact element configured to, when the base plate is arranged in the housing, provide an electrical connection between the inside and the outside of the housing, and a connecting element configured to connect the contact element to the base plate. The connecting element includes a first electrically insulating layer, a second electrically insulating layer configured to attach the contact element to the first electrically insulating layer, and a third electrically insulating layer configured to attach the first electrically insulating layer to the base plate.


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