The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Oct. 24, 2018
Applicants:

Fu Ding Precision Component (Shen Zhen) Co., Ltd., Shenzhen, CN;

Foxconn Interconnect Technology Limited, Grand Cayman, KY;

Inventor:

Fang-Jwu Liao, New Taipei, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/193 (2006.01); H01R 4/02 (2006.01);
U.S. Cl.
CPC ...
H01R 13/193 (2013.01); H01R 4/02 (2013.01); H01R 4/024 (2013.01);
Abstract

An electrical contact forms opposite top surface and bottom surface. A guiding groove is formed in the top surface. A mounting section is formed at an end of the contact. In the mounting section, a securing hole extends downwardly from the guiding groove and through the bottom surface. A solder unit is received within the securing hole and reaches a conductive pad, under the contact, to which the contact is soldered by reflowing the solder unit. The guiding groove extends from an oblique section of the contact so as to assure the socket unit can be smoothly dropped into the securing hole. The solder unit can be temporarily retained within the securing hole before reflowing.


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