The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2019
Filed:
Mar. 28, 2018
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Feroz Mohammad, Chandler, AZ (US);
Srinivasa Aravamudhan, Beaverton, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/52 (2011.01); H05K 7/20 (2006.01); H01R 12/72 (2011.01); H01R 12/71 (2011.01);
U.S. Cl.
CPC ...
H01R 12/52 (2013.01); H01R 12/716 (2013.01); H01R 12/722 (2013.01); H05K 7/2039 (2013.01);
Abstract
An electronic device that includes a first electronic component with a pin element and a second electronic component with a solder element. A joint is formed that provides an electrical and mechanical connection between the first electronic component and second electronic component when the pin element is heated, inserted into the solder element, and cooled.
Quick Actions:
Mohammad, Feroz. (2019). Pin through solder interconnect and methods (U.S. Patent No. 10505297). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10505297
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile