The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Jan. 10, 2017
Applicants:

The Board of Trustees of the University of Illinois, Urbana, IL (US);

Semprius, Inc., Durham, NC (US);

Inventors:

John Rogers, Champaign, IL (US);

Ralph Nuzzo, Champaign, IL (US);

Matthew Meitl, Durham, NC (US);

Etienne Menard, Durham, NC (US);

Alfred Baca, Urbana, IL (US);

Michael Motala, Champaign, IL (US);

Jong-Hyun Ahn, Suwon, KR;

Sang-Il Park, Savoy, IL (US);

Chang-Jae Yu, Urbana, IL (US);

Heung Cho Ko, Gwangju, KR;

Mark Stoykovich, Dover, NH (US);

Jongseung Yoon, Urbana, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/30 (2010.01); H01L 25/00 (2006.01); H01L 27/12 (2006.01); H01L 21/00 (2006.01); H01L 31/0725 (2012.01); H01L 31/18 (2006.01); H01S 5/42 (2006.01); H01L 25/075 (2006.01); H01L 31/054 (2014.01); H01L 33/58 (2010.01); H01L 33/00 (2010.01); H01L 31/0525 (2014.01); H01L 25/16 (2006.01); H01L 33/54 (2010.01); H01L 33/56 (2010.01); H01L 25/04 (2014.01); H01L 31/043 (2014.01); H01L 31/0216 (2014.01); H01L 31/0232 (2014.01); H01L 31/0288 (2006.01); H01L 31/0693 (2012.01); H01L 31/167 (2006.01); H01L 33/06 (2010.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01S 5/02 (2006.01); H01S 5/343 (2006.01); H01L 27/146 (2006.01); H01L 31/02 (2006.01); H01L 31/0304 (2006.01); H01L 33/52 (2010.01); H01S 5/022 (2006.01); H01S 5/183 (2006.01); H01S 5/30 (2006.01); B82Y 10/00 (2011.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 21/00 (2013.01); H01L 25/042 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 27/124 (2013.01); H01L 27/1214 (2013.01); H01L 27/1285 (2013.01); H01L 27/1292 (2013.01); H01L 27/14627 (2013.01); H01L 27/14636 (2013.01); H01L 27/14643 (2013.01); H01L 31/02005 (2013.01); H01L 31/02008 (2013.01); H01L 31/0288 (2013.01); H01L 31/02168 (2013.01); H01L 31/02325 (2013.01); H01L 31/02327 (2013.01); H01L 31/03046 (2013.01); H01L 31/043 (2014.12); H01L 31/0525 (2013.01); H01L 31/0543 (2014.12); H01L 31/0547 (2014.12); H01L 31/0693 (2013.01); H01L 31/0725 (2013.01); H01L 31/167 (2013.01); H01L 31/1804 (2013.01); H01L 31/1824 (2013.01); H01L 31/1868 (2013.01); H01L 31/1876 (2013.01); H01L 31/1892 (2013.01); H01L 33/005 (2013.01); H01L 33/0079 (2013.01); H01L 33/06 (2013.01); H01L 33/30 (2013.01); H01L 33/483 (2013.01); H01L 33/52 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01S 5/021 (2013.01); H01S 5/02284 (2013.01); H01S 5/183 (2013.01); H01S 5/3013 (2013.01); H01S 5/34326 (2013.01); H01S 5/423 (2013.01); B81C 2201/0185 (2013.01); B82Y 10/00 (2013.01); H01L 29/78603 (2013.01); H01L 29/78681 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0091 (2013.01); Y02E 10/52 (2013.01); Y02E 10/547 (2013.01); Y02P 70/521 (2015.11);
Abstract

Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.


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