The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2019
Filed:
Sep. 15, 2017
Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;
Semiconductor Manufacturing International (Beijing) Corporation, Beijing, CN;
Rongyao Chang, Shanghai, CN;
Yang Song, Shanghai, CN;
Abstract
The present disclosure is directed to a manufacturing method of a semiconductor device. The manufacturing method includes: providing an initial structure including a to-be-etched material layer and a mask structure located on the to-be-etched material layer, the mask structure including a hydrophilic first mask layer; patterning the mask structure to form a patterned mask structure; etching the to-be-etched material layer by using the patterned mask structure as a mask; performing hydrophobic processing on the first mask layer; and performing cleaning processing. The manufacturing method according to the present disclosure helps to prevent the first mask layer from being adhered or combined during the cleaning processing, thereby resolving the problem that a linear structure collapses.