The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Jun. 28, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Rajeev Bajaj, Fremont, CA (US);

Thomas H. Osterheld, Mountain View, CA (US);

Hung Chen, Sunnyvale, CA (US);

Terrance Y. Lee, Oakland, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/04 (2012.01); B24B 57/02 (2006.01); H01L 21/321 (2006.01); H01L 21/306 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
B24B 37/044 (2013.01); B24B 57/02 (2013.01); H01L 21/30625 (2013.01); H01L 21/3212 (2013.01); H01L 21/67075 (2013.01); H01L 21/67092 (2013.01);
Abstract

A substrate polishing apparatus is disclosed that includes a polishing platform having two or more zones, each zone adapted to receive a different slurry component. A substrate polishing system is provided having a holder to hold a substrate, a polishing platform having a polishing pad, and a distribution system adapted to dispense, in a timed sequence, at least two different slurry components selected from a group consisting of an oxidation slurry component, a material removal slurry component, and a corrosion inhibiting slurry component. Polishing methods and systems adapted to polish substrates are provided, as are numerous other aspects.


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