The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2019
Filed:
Jul. 25, 2017
Applicant:
Winbond Electronics Corp., Taichung, TW;
Inventor:
Yu-Ming Chen, Taichung, TW;
Assignee:
Winbond Electronics Corp., Taichung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/03 (2006.01); H05K 1/14 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01); H05K 3/12 (2006.01); B33Y 80/00 (2015.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4614 (2013.01); B33Y 80/00 (2014.12); H05K 1/0306 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 1/14 (2013.01); H05K 3/0014 (2013.01); H05K 3/12 (2013.01); H05K 3/4629 (2013.01); H05K 3/4664 (2013.01); H05K 3/403 (2013.01); H05K 2201/09045 (2013.01);
Abstract
A multi-layer circuit board including a plurality of insulation bumps, a first conductive layer, and a second conductive layer is provided. The plurality of insulation bumps are disposed between a first substrate and a second substrate. A top portion of the plurality of insulation bumps is served as a circuit connection point. The first conductive layer is disposed on the first substrate and connected to the circuit connection point. The second conductive layer is disposed on the second substrate and connected to the circuit connection point.