The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2019

Filed:

Jun. 01, 2018
Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Dandan Wang, Singapore, SG;

Lei Zhu, Singapore, SG;

Zhihong Mai, Singapore, SG;

Jeffrey Chor-Keung Lam, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/30 (2006.01); H01L 31/0232 (2014.01); G02B 6/38 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02327 (2013.01); G02B 6/30 (2013.01); G02B 6/3839 (2013.01); G02B 6/3885 (2013.01);
Abstract

A method of forming a wedge-shaped fiber array and a bottom base according to a probing pad layout of a Si-Photonic device to enable optical, DC and RF mixed signal tests to be performed at the same time and the resulting device are provided. Embodiments include a bottom base; and a fiber array with sidewalls and a top surface having a first angle and a second angle, respectively, over the bottom base, wherein the fiber array is structured to expose bond pads of a Si-Photonic device during wafer level Si-Photonic testing.


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