The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2019

Filed:

Feb. 22, 2017
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Deepak Thimmegowda, Fremont, CA (US);

Andrew R. Bicksler, Nampa, ID (US);

Roland Awusie, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11524 (2017.01); H01L 27/11556 (2017.01); H01L 27/1157 (2017.01); H01L 27/11582 (2017.01); H01L 29/10 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/788 (2006.01); H01L 29/792 (2006.01); H01L 21/28 (2006.01); H01L 29/16 (2006.01); H01L 29/49 (2006.01); H01L 21/283 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11524 (2013.01); H01L 21/283 (2013.01); H01L 21/28035 (2013.01); H01L 21/28097 (2013.01); H01L 27/1157 (2013.01); H01L 27/11556 (2013.01); H01L 27/11582 (2013.01); H01L 29/1033 (2013.01); H01L 29/16 (2013.01); H01L 29/4925 (2013.01); H01L 29/4983 (2013.01); H01L 29/6653 (2013.01); H01L 29/66666 (2013.01); H01L 29/66825 (2013.01); H01L 29/66833 (2013.01); H01L 29/78 (2013.01); H01L 29/7827 (2013.01); H01L 29/7828 (2013.01); H01L 29/7889 (2013.01); H01L 29/7926 (2013.01);
Abstract

Some embodiments include a transistor having a first electrically conductive gate portion along a first segment of a channel region and a second electrically conductive gate portion along a second segment of the channel region. The second electrically conductive gate portion is a different composition than the first electrically conductive gate portion. Some embodiments include a method of forming a semiconductor construction. First semiconductor material and metal-containing material are formed over a NAND string. An opening is formed through the metal-containing material and the first semiconductor material, and is lined with gate dielectric. Second semiconductor material is provided within the opening to form a channel region of a transistor. The transistor is a select device electrically coupled to the NAND string.


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