The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2019

Filed:

Dec. 06, 2016
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Ravi Srivastava, Clifton Park, NY (US);

Sunil K. Singh, Mechanicville, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/09 (2006.01); H01L 21/768 (2006.01); H01L 21/027 (2006.01); H01L 21/033 (2006.01); G03F 7/004 (2006.01); G03F 7/095 (2006.01); G03F 7/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76816 (2013.01); G03F 7/0043 (2013.01); G03F 7/094 (2013.01); G03F 7/095 (2013.01); G03F 7/40 (2013.01); H01L 21/0274 (2013.01); H01L 21/0337 (2013.01);
Abstract

Methods of lithographic patterning a dielectric layer. A first resist layer is formed on a hardmask layer, and a second resist layer is formed on the first resist layer. The second resist layer is patterned to form a first opening, which is transferred from the second resist layer to the first resist layer. The second resist layer is removed from the first resist layer after the first opening is transferred from the second resist layer to the first resist layer. The first resist layer is patterned to form a second opening laterally displaced in the first resist layer from the first opening. The first resist layer is comprised of a metal oxide photoresist that is removable selective to the hardmask layer. The hardmask layer and the dielectric layer may be subsequently patterned using first resist layer.


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