The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2019
Filed:
Jan. 23, 2017
Applicant:
Jenoptik Optical Systems Gmbh, Jena, DE;
Inventor:
Meik Panitz, Weimar, DE;
Assignee:
JENOPTIK Optical Systems GmbH, Jena, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); B65G 47/92 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67144 (2013.01); B65G 47/92 (2013.01); H01L 21/67132 (2013.01); H01L 21/6831 (2013.01); H01L 24/97 (2013.01); H01L 24/98 (2013.01); H01L 24/799 (2013.01); H01L 2224/7999 (2013.01); H01L 2224/98 (2013.01);
Abstract
Method and device for severing a microchip from a wafer and arranging the microchip on a substrate, wherein the microchip is contact-bonded to the free end of a tip during severing and accordingly adheres to the tip through adhesive force while the substrate is transported. A coordinate measuring machine can advantageously be used as device.