The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2019
Filed:
May. 22, 2017
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Ketan R. Shah, Olympia, WA (US);
Sean M. Halton, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 29/00 (2015.01); F21V 29/506 (2015.01); F21V 29/85 (2015.01); F21V 29/74 (2015.01); H01L 33/64 (2010.01); F21V 3/02 (2006.01); F21V 29/71 (2015.01); F21V 29/77 (2015.01); F21V 29/78 (2015.01); F21K 9/232 (2016.01); H01L 23/00 (2006.01); F21V 3/06 (2018.01); F21V 29/83 (2015.01); F21V 29/87 (2015.01); F21V 29/89 (2015.01); F21Y 101/00 (2016.01); F21Y 115/10 (2016.01); F21V 29/70 (2015.01);
U.S. Cl.
CPC ...
F21V 29/506 (2015.01); F21K 9/232 (2016.08); F21V 3/02 (2013.01); F21V 29/71 (2015.01); F21V 29/74 (2015.01); F21V 29/745 (2015.01); F21V 29/77 (2015.01); F21V 29/78 (2015.01); F21V 29/85 (2015.01); H01L 24/00 (2013.01); H01L 33/642 (2013.01); F21V 3/061 (2018.02); F21V 3/062 (2018.02); F21V 29/70 (2015.01); F21V 29/773 (2015.01); F21V 29/83 (2015.01); F21V 29/87 (2015.01); F21V 29/89 (2015.01); F21Y 2101/00 (2013.01); F21Y 2115/10 (2016.08); H01L 2924/00 (2013.01); H01L 2924/0002 (2013.01);
Abstract
Embodiments of the invention provide lighting systems that employ light-emitting diode (LED) chips as active lighting elements. Heat management components for the LED chips employed in the lighting sources are provided. In embodiments of the invention, LED chips are cooled by one or more heatspreaders and heat sinks attached to a substrate that houses the LED chip and/or the topside of the LED chip.