The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2019

Filed:

Sep. 14, 2016
Applicant:

Shengyi Technology Co., Ltd., Guangdong, CN;

Inventors:

Jiang You, Guangdong, CN;

Tianhui Huang, Guangdong, CN;

Yongjing Xu, Guangdong, CN;

Zhongqiang Yang, Guangdong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/32 (2006.01); C08L 63/00 (2006.01); C08L 79/04 (2006.01); C08K 5/49 (2006.01); C08G 59/32 (2006.01); C08G 59/40 (2006.01);
U.S. Cl.
CPC ...
C08K 3/32 (2013.01); C08G 59/3236 (2013.01); C08G 59/4014 (2013.01); C08K 5/49 (2013.01); C08L 63/00 (2013.01); C08L 79/04 (2013.01); C08L 2201/02 (2013.01); C08L 2203/206 (2013.01);
Abstract

The present invention provides a halogen-free thermosetting resin composition, a prepreg, a laminate and a printed circuit board comprising the same. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free thermosetting resin, (B) from 10 to 35 parts by weight of a phenolic curing agent, and (C) a phosphorus-containing flame retardant. The prepregs, laminates and printed circuit boards prepared from the halogen-free thermosetting resin composition of the present invention have excellent dimensional stability and dielectric properties, high adhesive force, high heat resistance, low water absorption and better processability, and can achieve halogen-free flame retardancy and reach UL94 V-0.


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