The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2019

Filed:

Jan. 30, 2018
Applicants:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Stmicroelectronics, Inc., Coppell, TX (US);

Inventors:

Domenico Giusti, Monza, IT;

Marco Ferrera, Concorezzo, IT;

Carlo Luigi Prelini, Seveso, IT;

Simon Dodd, West Linn, OR (US);

Assignees:

STMICROELECTRONICS S.R.L., Agrate Brianza, IT;

STMICROELECTRONICS, INC., Coppell, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/18 (2006.01); B41J 2/055 (2006.01); B41J 2/16 (2006.01); B05B 1/02 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14 (2013.01); B05B 1/02 (2013.01); B41J 2/055 (2013.01); B41J 2/14233 (2013.01); B41J 2/161 (2013.01); B41J 2/1623 (2013.01); B41J 2/1626 (2013.01); B41J 2/1628 (2013.01); B41J 2/1629 (2013.01); B41J 2/1631 (2013.01); B41J 2/18 (2013.01); B41J 2002/14346 (2013.01); B41J 2002/14403 (2013.01); B41J 2002/14419 (2013.01); B41J 2202/12 (2013.01);
Abstract

Ejection device for fluid, comprising a solid body including: first semiconductor body including a chamber for containing the fluid, an ejection nozzle in fluid connection with the chamber, and an actuator operatively connected to the chamber to generate, in use, one or more pressure waves in the fluid such as to cause ejection of the fluid from the ejection nozzle; and a second semiconductor body including a channel for feeding the fluid to the chamber, coupled to the first semiconductor body, in such a way that the channel is in fluid connection with the chamber. The second semiconductor body integrates a damping cavity over which extends a damping membrane, the damping cavity and the damping membrane extending laterally to the channel for feeding the fluid.


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