The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2019

Filed:

Dec. 24, 2015
Applicant:

Lintec Corporation, Itabashi-ku, JP;

Inventors:

Kunihisa Kato, Warabi, JP;

Tsuyoshi Mutou, Saitama, JP;

Wataru Morita, Saitama, JP;

Yuma Katsuta, Gyoda, JP;

Takeshi Kondo, Saitama, JP;

Assignee:

LINTEC CORPORATION, Itabashi-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 35/26 (2006.01); F25B 21/02 (2006.01); H01L 35/24 (2006.01); H01L 35/34 (2006.01); H01L 35/16 (2006.01); H01L 35/32 (2006.01);
U.S. Cl.
CPC ...
H01L 35/26 (2013.01); F25B 21/02 (2013.01); H01L 35/16 (2013.01); H01L 35/24 (2013.01); H01L 35/32 (2013.01); H01L 35/34 (2013.01);
Abstract

To provide a Peltier cooling element that is excellent in thermoelectric performance and flexibility and can be manufactured easily at low cost. A Peltier cooling element containing a thermoelectric conversion material containing a support having thereon a thin film containing a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, and a method for manufacturing a Peltier cooling element containing a thermoelectric conversion material containing a support having thereon a thin film containing a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, the method containing: coating a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, on a support, and drying, so as to form a thin film; and subjecting the thin film to an annealing treatment.


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