The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2019

Filed:

Dec. 23, 2016
Applicant:

Sensor Electronic Technology, Inc., Columbia, SC (US);

Inventors:

Remigijus Gaska, Columbia, SC (US);

Maxim S. Shatalov, Columbia, SC (US);

Alexander Dobrinsky, Loudonville, NY (US);

Jinwei Yang, Columbia, SC (US);

Michael Shur, Latham, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/56 (2010.01); H01L 33/64 (2010.01); H01L 33/50 (2010.01); H01L 31/0203 (2014.01); H01L 31/0232 (2014.01); H01L 31/024 (2014.01); C09D 163/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); C09D 163/00 (2013.01); H01L 31/0203 (2013.01); H01L 31/024 (2013.01); H01L 31/02322 (2013.01); H01L 31/02327 (2013.01); H01L 33/502 (2013.01); H01L 33/641 (2013.01); H01L 2933/0091 (2013.01); Y10T 428/23 (2015.01);
Abstract

A composite material, which can be used as an encapsulant for an ultraviolet device, is provided. The composite material includes a matrix material and at least one filler material incorporated in the matrix material that are both at least partially transparent to ultraviolet radiation of a target wavelength. The filler material includes microparticles and/or nanoparticles and can have a thermal coefficient of expansion significantly smaller than a thermal coefficient of expansion of the matrix material for relevant atmospheric conditions. The relevant atmospheric conditions can include a temperature and a pressure present during each of: a curing and a cool down process for fabrication of a device package including the composite material and normal operation of the ultraviolet device within the device package.


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