The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2019
Filed:
Dec. 27, 2016
Ubiq Semiconductor Corp., Zhubei, Hsinchu County, TW;
Masamichi Yanagida, Gunma-ken, JP;
Masashi Koyano, Gunma-ken, JP;
Nobuyoshi Matsuura, Gunma-ken, JP;
Hiroki Arai, Gunma-ken, JP;
UPI SEMICONDUCTOR CORP., Zhubei, Hsinchu County, TW;
Abstract
The present invention provides a semiconductor device that can achieve miniaturization or thinning of the size of the package while maintaining the characteristic of the MOSFET and reducing the on-resistance value, and a portable apparatus using the same. The gate electrodesandof the semiconductor chipare disposed in the vicinity of the two side surfaces of the longitudinal direction (the x axis direction on the page) of the package, and the gate terminalandthat is mounted with the gate electrodesandin a flip-chip manner are extended in the longitudinal direction of the packageand are derived to the outside from the two side surfacesA andB. Based on the configuration, it is capable of maximizing the size of the semiconductor chip with respect to the size of the package, and it is able to realize the high performance of the element characteristic for the module.